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W3H128M72E-667NBM

Part No W3H128M72E-667NBM
Manufacturer Microsemi
Description DRAM Module DDR2 SDRAM 1Gbyte
Lead Free Status / RoHS Status Contains lead /RoHS non-compliant
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Specifications

Data sheet

Organization128Mx72
PCB changed208
ECCN (US)4A994.a
Chip Package TypePBGA
Data Bus Width (bit)72
Operating Current (mA)1375
Minimum Operating Temperature (°C)-55
Maximum Operating Temperature (°C)125
PLLNo
Supplier PackageBGA
Chip Density (bit)1.8G
Number of Chip Banks8
Package Height3.94(Max)
Maximum Operating Supply Voltage (V)1.9
Maximum Clock Rate (MHz)667
RoHS StatusSupplier Unconfirmed
Number of Chip per Module5
ECC SupportYes
Module Density1Gbyte
Self RefreshYes
Package Length22.1(Max)
Supplier Temperature GradeMilitary
Pin Count208
MountingSurface Mount
SPD EEPROM SupportNo
CAS Latency6
Max. Access Time (ns)1.25
SubcategoryDDR2 SDRAM
Typical Operating Supply Voltage (V)1.8
Package Width16.1(Max)
ModuleDRAM Module
Minimum Operating Supply Voltage (V)1.7

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