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Interface - Sensor and Detector Interfaces
| Image | Part Number | Manufacturers | Description | Lead Free | RoHS | View |
|---|---|---|---|---|---|---|
 |
ZSSC3218BI1B ES | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC3218BI1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC3218BI1D ES | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
|
ZSSC3224BI1B ES | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC3224BI1D ES | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
|
ZSSC4151AE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4151AE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4161BE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4161BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4162BE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4162BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4165BE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4165BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4165BE1D ES | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
|
ZSSC4165DE1B | Integrated Device Technology | WAFER (UNSAWN) - WAFER BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4165DE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4165DE1D | Integrated Device Technology | DICE (WAFER SAWN) - WAFFLE PACK | Contains Lead | compliant | RFQ >> |
|
ZSSC4169DE1B | Integrated Device Technology | WAFER (UNSAWN) - WAFER BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4169DE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4169DE4B | Integrated Device Technology | WAFER (UNSAWN) - WAFER BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4169DE4C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4171BE1B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC4171BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC4175DE2B | Integrated Device Technology | WAFER (UNSAWN) - WAFER BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC5101BE1C | Integrated Device Technology | DICE (WAFER SAWN) - FRAME | Contains Lead | compliant | RFQ >> |
|
ZSSC5101BE2B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
|
ZSSC5101BE3B | Integrated Device Technology | WAFER (UNSAWN) - BOX | Contains Lead | compliant | RFQ >> |
